Forming Holes in Silicon Substrates by using Ultrasonic Machining.

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چکیده

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ژورنال

عنوان ژورنال: IEEJ Transactions on Sensors and Micromachines

سال: 1997

ISSN: 1341-8939,1347-5525

DOI: 10.1541/ieejsmas.117.55